![]() ![]() The chiplet has about 3.8 billion transistors, while the 12 nm I/O die (IOD) is ~125 mm 2 and has 2.09 billion transistors. ![]() These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm 2 in size. With Zen 2, each CPU chiplet houses 8 CPU cores, arranged in 2 core complexes (CCXs), each of 4 CPU cores. On the middle: Die shot of a Zen 2 EPYC/Threadripper I/O die, On the right (bottom): I/O die of a Zen 2 mainstream Ryzen I/O die. On the left (top on mobile): Die shot of a Zen 2 Core Complex Die. Simplified illustration of the Zen 2 microarchitecture In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores. ![]() The CPU dies (referred to by AMD as core complex dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the chances of a die having a defect increases with device (die) size) while also allowing for more dies per wafer. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. This separation has benefits in scalability and manufacturability. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own, separate die, which is also called a chiplet in this context. Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. The CPU on the left/top (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and up to two CCDs (only one is used on this particular example), while the one on the right/bottom (used for high-end desktop, HEDT, Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs. Two delidded Zen 2 processors designed with the multi-chip module approach. The Steam Deck, PlayStation 5, Xbox Series X and Series S all use chips based on the Zen 2 microarchitecture, with proprietary tweaks and different configurations in each system's implementation than AMD sells in its own commercially available APUs. ![]() Zen 2 delivers about 15% more instructions per clock than Zen and Zen+, the 14- and 12-nm microarchitectures utilized on first and second generation Ryzen, respectively. This architecture is nearly identical to the layout of the "pro-consumer" flagship processor Threadripper 3990X. Using this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket. Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process (" chiplets") are combined with a 14 nm I/O die on each multi-chip module (MCM) package. Zen 2 includes hardware mitigations to the Spectre security vulnerability. At Computex 2019, AMD revealed that the Zen 2 "Matisse" processors would feature up to 12 cores, and a few weeks later a 16 core processor was also revealed at E3 2019, being the aforementioned Ryzen 9 3950X. AMD CEO Lisa Su also said to expect more than eight cores in the final lineup. Īt CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. An additional chip, the Ryzen 9 3950X, was released in November 2019. The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. Zen 2 is a computer processor microarchitecture by AMD. Mendocino (mobile and embedded refresh).Renoir (Desktop APU, mobile and embedded). ![]()
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